标准摘要
[中文适用范围]： 本技术规范为在符合 IEC 60297（19 英寸）和 IEC 60917（25 毫米）系列的机柜中安装热电冷却系统（帕尔贴效应）提供了指南。冷却性能与机柜内的安装位置直接相关。确定了三种典型的安装位置：安装位置 1：机柜内或外安装热电冷却系统以冷却整个机柜；安装位置 2：机柜顶部安装热电冷却系统以冷却整个机柜；安装位置 3：机柜内内置热电冷却系统（子架形式）用于热点冷却。 [外文原描述]： IEC/TS 62610-1:2009(E) provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets ofthe IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified: 1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet; 2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet; 3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.
英文名称Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)