标准摘要
[中文适用范围]： 本技术规范确立了记录减轻无铅锡在电子系统中有害影响的步骤的过程。本技术规范适用于采购可能含有无铅锡镀层的设备航空航天、国防和高性能 (ADHP) 电子应用。本文件可由其他高性能和高可靠性行业酌情使用。 [外文原描述]： IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.
英文名称Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin