航空电子设备工艺管理.包含无铅焊料的航空航天和防御电子系统.第22部分:技术指南

[中文适用范围]： IEC 62647 的第 22 部分旨在为航空航天、国防和高性能（ADHP）电子应用和系统供应商（例如原始设备制造商（OEM）和系统维护设施）提供技术指导，以便在开发和实施设计和工艺，确保在过渡到无铅电子以及过渡后，高性能航空航天系统（随后称为 ADHP）的持续性能、质量、可靠性、安全性、适航性、构型控制、成本效益、可维护性和支持性。这些准则可由 OEM 和维护设施使用，以实施其用于确保产品性能、可靠性、适航性、安全性和可认证性的方法，符合 IEC/TS 62647-1:2012。本文件还包含以前在无铅航空航天电子系统方面经验的教训。这些教训提供了关于焊料合金和其他材料及其对各种运行环境条件的预期适用性的具体参考。这些教训仅用于指导，不保证在任何给定应用中取得成功。本文件可由其他高性能和高可靠性行业酌情使用。 [外文原描述]： IEC/TS 62647-22:2013(E) is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems both during and after the transition to Pb-free electronics. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012. This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems.