标准摘要
[中文适用范围]： 本文档提供了技术背景、采购指南、工程程序和指南，以协助组织对使用传统合金（如锡铅或无铅合金）或两者组合进行组装或维修的航空航天和高性能电子系统进行返修/维修。本文件包含对已知影响和问题的审查，以及针对返修/维修的过程，旨在为技术人员执行任务提供技术结构。本文件重点关注元器件的去除和更换。在本文件中，术语“返修/维修”按3.1.29和3.1.30中的定义使用。本文件中的信息基于发布时行业的当前知识。由于知识库的快速变化，本文件仅作为指导使用。 [外文原描述]： IEC/TS 62647-23:2013(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. The information contained within this document is based on the current knowledge of the industry at the time of publication.
英文名称Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies