标准摘要
[中文适用范围]： 本文件描述了器件嵌入式基板的基础。本文件适用于使用有机基板材料制造的器件嵌入式基板，其中包括例如有源或无源器件、电子布线板制造过程中形成的分立元件以及片状元件。IEC 62878 系列不适用于重布线层（RDL）或定义为 IEC 62421 中 M 型商业模式的电子模块。 [外文原描述]： IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
英文名称Device embedded substrate - Part 2-1: Guidelines - General description of technology