标准摘要
[中文适用范围]： 本部分 IEC 62878 描述了设备嵌入式基板的指南。设备嵌入式基板的设计指南本质上与各种电子电路板的设计指南相同。本部分 IEC 62878 有助于透彻理解电路设计、结构设计、板设计、电路板制造、组装工艺 (jisso) 和产品的测试。本部分 IEC 62878 适用于使用有机基材料制造的设备嵌入式基板，其中包括例如在电子布线板制造过程中形成的有源或无源设备、分立元件以及片状元件。IEC 62878 系列不适用于重分布层 (RDL) 或定义为 IEC 62421 中 M 型商业模式的电子模块。 [外文原描述]： IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
英文名称Device embedded substrate - Part 2-3: Guidelines - Design guide