陶瓷砖 第23部分：釉面和无釉陶瓷砖弹性模量的测定 基板和釉层

[中文适用范围]： 本文件规定了通过三点弯曲试验测定釉面和无釉陶瓷砖在常温下基材及釉层弹性模量的测试方法。本文件还规定了试样制备、试验方式、加载速率、数据采集和报告的程序。该测试方法可用于板状陶瓷砖的材料研究、质量控制、特性分析和设计数据生成。更多信息请参见附录A。本方法不适用于无法加工出试样的带凹凸结构的陶瓷砖。 [外文原描述]： This document specifies a testing method for determining the elastic modulus of glazed and unglazed ceramic tiles, substrate and glaze layer at ambient temperature by three-point bending tests. This document also specifies procedures for test specimen preparation, test modes, load rates, data collection and reporting. This test method can be used for material research, quality control, characterization and design data-generation purposes of ceramic tiles with a plate shape. See Annex A for more information. This method is not applicable to the ceramic tiles with profiled structures from which the test specimen cannot be machined.