标准摘要
[中文适用范围]： 本文件规定了非导电基材上导电涂层厚度的无损测量方法。 该方法基于薄层电阻率测量原理，适用于金属和半导体材料的任何导电涂层和层。 一般来说，必须根据相应应用的电导率和厚度调整探头。 然而，本文件重点关注非导电基材上的金属涂层（例如塑料基材、印刷电路板上的铜）。 如果涂层和基材的电阻率明显不同，则该方法也适用于导电基材上导电涂层的厚度测量。 然而，本文档不考虑这种情况。 [外文原描述]： This document specifies a method for non-destructive measurements of the thickness of conductive coatings on non-conductive base materials. This method is based on the principle of the sheet resistivity measurement and is applicable to any conductive coatings and layers of metal and semiconductor materials. In general, the probe has to be adjusted to the conductivity and the thickness of the respective application. However, this document focuses on metallic coatings on non-conductive base materials (e.g. copper on plastic substrates, printed circuit boards). This method is also applicable to thickness measurements of conductive coatings on conductive base materials, if the resistivity of the coating and the base material is significantly different. However, this case is not considered in this document.
英文名称Metallic coatings on non-metallic basis materials — Measurement of coating thickness — Micro-resistivity method