标准摘要
[中文适用范围]： 该文件定义了将光波耦合进出集成光学芯片（IOC）和带有光子集成电路（PIC）的芯片的相关属性。 本文档主要关注通过波导端面的对接耦合。 这些定义为指定与耦合特性相关的待耦合元件（例如光纤、集成光学芯片）提供了基础。 [外文原描述]： This document defines the relevant properties for coupling lightwaves into and out of integrated optical chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibres, integrated optical chips) related to coupling properties.
英文名称Integrated optics — Interfaces — Parameters relevant to coupling properties