固定源排放

[中文适用范围]： 本文件提供了计算半导体和显示器行业温室气体 (GHG) 排放量的方法。本文件包括半导体设备、微机电系统 (MEMS)、光伏 (PV) 设备和显示器的制造。本文件允许报告各种目的和不同基础上的 GHG 排放量，例如按工厂、按公司（按国家或地区）或按国际集团。本文件涉及以下所有直接和间接温室气体来源： — 来自公司拥有或控制的来源的直接温室气体排放[定义见 ISO 14064-1:2018, 5.2.4 a)]，例如来自以下来源的排放： — 工艺：蚀刻和晶圆清洗（EWC）、远程等离子清洗（RPC）、原位等离子清洗（IPC）、原位热清洗（ITC）、N2O 薄膜沉积（TFD）和其他使用 N2O 的工艺中使用的氟化合物（FC）气体和一氧化二氮（N2O）； — 与设备和现场车辆、房间供暖/制冷有关的燃料燃烧； — 用于现场发电的燃料的燃料燃烧； — 组织消耗的进口电力、热能或蒸汽发电产生的间接温室气体排放[定义见 ISO 14064-1:2018, 5.2.4 b)]。其他间接温室气体排放[定义见 ISO 14064-1:2018, 5.2.4 c) 至 f)]是组织活动的结果，但来自其他组织拥有或控制的温室气体源，因此不在本文件范围内。 [外文原描述]： This document provides a methodology for calculating greenhouse gas (GHG) emissions from the semiconductor and display industry. This document includes the manufacture of semiconductor devices, microelectromechanical systems (MEMS), photovoltaic (PV) devices and displays. This document allows to report GHG emissions for various purposes and on different bases, such as a per-plant basis, per-company basis (by country or by region) or an international group basis. This document addresses all of the following direct and indirect sources of GHG: — direct GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 a)] from sources that are owned or controlled by the company, such as emissions resulting from the following sources: — process: fluorinated compound (FC) gases and nitrous oxide (N 2 O) used in etching and wafer cleaning (EWC), remote plasma cleaning (RPC), in situ plasma cleansing (IPC), in situ thermal cleaning (ITC), N 2 O thin film deposition (TFD), and other N 2 O using process; — fuel combustion related to equipment and on-site vehicles, room heating/cooling; — fuel combustion of fuels for on-site power generation; — indirect GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 b)] from the generation of imported electricity, heat or steam consumed by the organization. Other indirect GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 c) to f)], which are the consequence of an organization’s activities, but arise from GHG sources that are owned or controlled by other organizations, are excluded from this document.