精细陶瓷（高级陶瓷 高级工业陶瓷）.陶瓷弯曲粘结强度的试验方法

[中文适用范围]： 本文件规定了测定陶瓷/陶瓷接头或陶瓷/金属接头在室温下的弯曲粘合强度的试验方法。 基板材料，例如陶瓷或金属，都是整体的。 该方法可用于测试弯曲条件下接头的界面结合强度。 它可用于连接材料的开发和/或接头的质量控制、表征和生成设计数据的目的。 [外文原描述]： This document specifies a test method for determining the flexural bond strength of ceramic/ceramic joints or ceramic/metal joints at room temperature. The substrate materials, for example ceramic or metal, are both monolithic. This method can be used to test the interfacial bond strength of the joint under bending conditions. It can be used for the development of joining materials and/or for the quality control of joints, the characterization and generating design data purposes.