机床试验规程第10部分:数控机床探测系统测量性能的测定

[中文适用范围]： 本文件规定了评估与数控机床集成的探测系统的测量性能的测试程序。7.1 中规定了在离散点测量模式下运行的接触触发探测系统和扫描探测系统的测试程序。7.2 中规定了扫描探测系统的测试程序，7.3 中规定了孔径量规系统的测试程序，8.1 中规定了接触式刀具测量系统的测试程序，8.2 中规定了使用激光光栅原理的非接触式刀具测量系统的测试程序。 用作坐标测量机 (CMM) 的机床性能评估不属于本文件的范围。 这种性能评估涉及可追溯性问题，受到机床几何精度的强烈影响，除了本文件中指定的机床探测系统测试之外，还可以根据 ISO 10360-2 和 ISO 10360-5 进行评估。 本文件中测试程序的描述是指加工中心。 然而，测试原则上适用于大多数数控机床。 [外文原描述]： This document specifies test procedures to evaluate the measuring performance of probing systems integrated with a numerically controlled machine tool. Test procedures for touch trigger probing systems and scanning probing systems operating in discrete-point measurement mode are specified in 7.1. Test procedures are specified for scanning probing systems in 7.2, for bore gauge systems in 7.3, for contacting tool measuring systems in 8.1, and for non-contacting tool measuring systems using the laser light barrier principle in 8.2. The evaluation of the performance of the machine tool, used as a coordinate measuring machine (CMM), is outside the scope of this document. Such performance evaluation involves traceability issues, is strongly influenced by machine tool geometric accuracy and can, in addition to the machine tool probing system tests specified in this document, be evaluated according to ISO 10360-2 and ISO 10360-5. Descriptions of test procedures in this document are referred to machining centres. However, tests apply in principle to most NC machine tools.