标准摘要
[中文适用范围]： 提供了一种评估电子设备可用性的方法，适用于涉及玻璃金属密封的应用，或依赖于氧化铜粘附膜的形成和存在的其他用途。 该程序包括制备试件并在空气中加热，然后在水中快速冷却并目视检查氧化膜的损失或起泡。 [外文原描述]： Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.
英文名称Oxygen-free copper — Scale adhesion test