标准摘要
[中文适用范围]： 该文件规定了一种测量加热器芯片和冷板之间热阻的方法，其中加热器芯片安装在金属化陶瓷基板上，模拟碳化硅（SiC）高输出功率模块。 该测量结果代表了高输出功率模块中使用的金属化陶瓷基板的散热特性的指标。 [外文原描述]： This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
英文名称Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for thermal property measurements of metalized ceramic substrates — Part 1: Evaluation of thermal resistance for use in power modules