标准摘要
[中文适用范围]： 本文件规定了评估焊接过程后软焊剂残留物粘性的定性方法。 该方法适用于所有助焊剂、焊膏和药芯焊丝。 该方法特别适合焊剂残留物留在电气和电子设备上的应用。 [外文原描述]： ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
英文名称Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues