标准摘要
[中文适用范围]： 本文件规定了一种测试焊接或镀锡测试附连件后助焊剂残留物可能产生的有害影响的方法。该测试适用于 ISO 9454-1 中规定的 1 类和 2 类助焊剂，无论是固体还是液体形式，或者是由共晶或近共晶锡构成的药芯焊丝、焊料预成型件或焊膏形式。 /铅 (Sn/Pb) 或 Sn95,5Ag3Cu0,5 或用户和供应商同意的其他无铅焊料（参见 ISO 9453）。该测试方法也适用于与含铅和无铅焊料一起使用的助焊剂。然而，焊接温度可以根据测试人员和客户的协议进行调整。 [外文原描述]： This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
英文名称Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues