标准摘要
[中文适用范围]： 本国际标准适用于点对点串行可扩展互连的物理连接器和电缆、电气属性和逻辑协议，在铜缆和光纤技术中以 10 Mbit/s 至 200 Mbit/s 和 1 Gbit/s 的速度运行（如开放微处理器系统计划/异构互连项目 (OMI/HIC) 中开发的）。 该国际标准的目标是能够以较低的系统集成成本构建高性能、可扩展、模块化、并行系统；支持通信系统结构；提供一系列高级协议（通信，例如ATM、消息传递、共享内存事务等）的透明实现，并支持异构系统之间的链接。 [外文原描述]： The construction of high-performance systems with parallel communications, parallel processing, and/or parallel I/O demands a fast, low-cost, low-latency interconnect. It must be fast and low-latency, otherwise it will be the limiting factor in system performance; and it must be low-cost, or it will dominate the system cost. This standard has been developed to complement recent technical developments of highly integrated, low-power interconnect technology implemented in high-volume commodity VLSI processes, and to exploit the simplifications in encodings and protocols resulting from the use of relatively reliable media over relatively short distances.
英文名称Information technology - Microprocessor systems - Heterogeneous InterConnect (HIC) (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)