标准摘要
This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.Cross Reference: AMS2350,AMS2350B,AMS2825,AMS3751,ASTMD1002,ASTMD149,ASTMD150,ASTMD1674,ASTMD1824,ASTMD2240,ASTMD256,ASTMD257,ASTMD570,ASTMD635,ASTMD648,ASTMD695,ASTMD696,ASTMD790,ASTMD792,MIL-STD-794
英文名称POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible