标准摘要
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.Cross Reference: AMS2350,AMS2350B,FED-A-A-113,FED-STD-406,MIL-B-13949/13,MIL-B-22191,MIL-F-14256,MIL-P-13949,MIL-P-13949/10,MIL-STD-202,MIL-STD-275
英文名称Polyimide Printed Circuit Boards Fabrication of