SAE ARP6415-2019 Issued

焊料无铅球栅阵列元件的应用

标准摘要

This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.Cross Reference:
英文名称Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

替代关系

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