标准摘要
This document applies to the development of Plans for integrating and managing electronic materials and processes for equipment in the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document.Examples of electronic materials and processes, as described in this document, include soldering alloys, plating finishes, bulk metals, chassis materials and finishes, materials used for mechanical parts, etc.It is critical for the Plan owner to review and understand the properties and configuration control of all “as-received” or “off-the-shelf” electronic materials with respect to the application capabilities in order to identify risks, and where necessary, take additional action to mitigate the risks.The technical requirements are in Section 3 of this standard, and the administrative requirements are in Section 4 .Cross Reference:
英文名称Requirements for an Electronic Materials and Processes Management Plan