标准摘要
This technical report identifies the requirements for an LFCP for ADHP soldered electronic products built fully or partially with Pb-free materials and assembly processes. An LFCP documents the specific Pb-free materials and assembly processes used to assure customers their ADHP soldered electronic products will meet the applicable reliability requirements of the customer. This standard specifically addresses LFCPs for:aPb-free components and mixed assembly: Products originally designed and qualified with SnPb solder and assembly processes that incorporate components with Pb-free termination finishes and/or Pb-free BGAs, i.e., assembling Pb-free parts using eutectic/near-eutectic SnPb processes (also known as mixed metallurgy).bCOTS products: COTS products likely built with Pb-free materials and assembly processes.cPb-free design and assembly: Products designed and qualified with Pb-free solder and assembly processes.This standard does not include detailed descriptions of the processes to be documented in an LFCP, but lists high-level requirements for ADHP soldered electronic products using Pb-free materials and assembly processes, such as requirements for manufacturing and reliability, configuration control and product identification, and rework, repair, and maintenance.This standard is structured to enable tailoring, i.e., deleting, adding, or modifying requirements as applicable to the product, system or program under consideration. Tailoring GEIA-STD-0005-1 requires agreement between the LFCP user and customer before implementation.Cross Reference:
英文名称Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products