_3A 包含无铅焊料和表面处理的航空航天和高性能电子互连的性能测试

This standard establishes processes for performing and documenting mitigation steps taken to reduce the harmful effects of tin whiskers in electronic systems for ADHP applications. This includes electronic piece parts and mechanical hardware that are used on or in the proximity of electronics.This document identifies the requirements for mitigating the effects of tin whiskers applicable to the requirements of the SAE GEIA-STD-0005-1 Lead-free Control Plan (LFCP). An LFCP documents the specific Pb-free materials and assembly processes the LFCP owner will use to eliminate or mitigate the Pb-free risks to assure customers that their ADHP soldered electronic products will meet the applicable reliability requirements of the customer. This standard may also be used independently of SAE GEIA-STD-0005-1.