汽车电气/电子模块耐用性鉴定用手册

[中文适用范围]： 本文件讨论了汽车应用中使用的电气/电子模块的鲁棒性。在可行的情况下，还将讨论外在可靠性检测和预防的方法。本文档主要涉及电气/电子模块 (EEM)，但可以轻松适用于机电一体化、传感器、执行器和开关。 EEM 资格是本文件的主要范围。 CPI（组件过程交互）第 10 节专门讨论了解决随机故障的其他程序。本文件将在组件制造和产品使用的零缺陷概念的背景下使用。这是 [外文原描述]： This document addresses robustness of electrical/electronic modules for use in automotive applications. Where practical, methods of extrinsic reliability detection and prevention will also be addressed. This document primarily deals with electrical/electronic modules (EEMs), but can easily be adapted for use on mechatronics, sensors, actuators and switches. EEM qualification is the main scope of this document. Other procedures addressing random failures are specifically addressed in the CPI (Component Process Interaction) section 10 . This document is to be used within the context of the Zero Defect concept for component manufacturing and product use.It is recommended that the robustness of semiconductor devices and other components used in the EEM be assured using SAE J1879 OCT2007, Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications.The emphasis of this document is on hardware and manufacturing failure mechanisms, however, other contemporary issues as shown in Figure 1 need to be addressed for a thorough Robustness Validation. A Pareto of contemporary issues is shown in Figure 1 . Although this document addresses many of the issues shown, however some are outside the scope of this document and will need to be addressed for a thorough RV process application. Examples of issues outside the scope of this document are system interactions, interfaces, functionality, HMI (Human-Machine Interface) and software. At the time of publication of this handbook, a system level Robustness Validation handbook, which addresses these issues, had been initiated.Cross Reference: 2006-01-0591,2006-01-0729,G-11,IEC60300-3-1,IEC60300-3-9,IEC60812,IEC61205,ISO16750,ISO21747,J1739_202101,J1879_201402,J2628_201307,J2837,MIL-STD-810