集成电路辐射发射的测量-Tem/宽带 Tem（Gtem）电池方法； Tem Cell（150 Khz 至 1 Ghz）、宽带 Tem Cell（150 Khz 至 8 Ghz

[中文适用范围]： 该测量程序定义了一种测量集成电路 (IC) 电磁辐射的方法。待评估的 IC 安装在 IC 测试印刷电路板 (PCB) 上，该印刷电路板夹在 TEM 或宽带 TEM (GTEM) 单元顶部或底部切割的配合端口（称为墙壁端口）上。测试板不像常规使用那样位于电池内，而是成为电池壁的一部分。该方法适用于任何经过改造以合并壁端口的 TEM 或 GTEM 单元；然而，测得的射频电压受到隔膜与测试板（墙）间距的影响。该程序是使用隔膜与壁间距为 45 mm 的 1 GHz TEM 单元和端口区域上隔膜与壁平均间距为 45 mm 的 GTEM 单元开发的。其他电池可能不会产生相同的光谱输出，但可用于比较测量，但受其频率和灵敏度限制。 [外文原描述]： This measurement procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a TEM or wideband TEM (GTEM) cell. The test board is not in the cell as in the conventional usage but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured RF voltage is affected by the septum to test board (wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to wall spacing of 45 mm and a GTEM cell with average septum to wall spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to wall spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 Ω ports is terminated with a 50 Ω load. The other 50 Ω port for a TEM cell, or the single 50 Ω port for a GTEM cell, is connected to the input of a spectrum analyzer or receiver that measures the RF emissions emanating from the IC and coupled onto the septum of the TEM cell.Cross Reference: IEC61967,J1752/1_201605