标准摘要
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.Cross Reference: EIA J-STD-020,EIA JESD-22-A113,EIA659,IPC/JEDEC J-STD-033
英文名称Environmental Tests and Associated Failure Mechanisms